SIASUN's Wafer Transfer Robot product line is purpose-built for semiconductor front-end processes, operating in Class 1 ultra-clean environments to enable high-speed, smooth, and damage-free transfer of 12-inch (300 mm) wafers. Backed by nearly 20 years of core-team expertise and fully proprietary intellectual property, the technology meets international benchmarks for precision and reliability.

The portfolio covers the complete front-end automation chain: EFEM (Equipment Front-End Module), atmospheric robot arms (Blade D and Blade S series), vacuum transfer robots, Loadport wafer load ports, SMIF wafer loading devices, Aligner pre-alignment stations, and vertical furnace mini-stocker (Mini STK) solutions.

Direct-drive technology delivers ultra-high positioning accuracy and repeatability, satisfying the wafer auto-loading and unloading requirements of lithography, etch, CVD/PVD, and other process tools — significantly improving line throughput and yield.

Manufactured in a 10,000 m² cleanroom facility with a team of over 300 R&D engineers, SIASUN provides scalable, high-reliability automation solutions to semiconductor equipment suppliers worldwide.

• Wafer size: 12-inch (300 mm)
• Cleanroom class: Class 1
• Drive technology: Direct drive
• Products: EFEM, Blade D atmospheric robot, Blade S atmospheric robot, Mini STK vertical furnace stocker, SMIF wafer loading device, Loadport wafer loading device, Aligner pre-alignment device
• Applications: Lithography, etch, thin-film deposition (CVD/PVD), and other front-end process equipment
• Cleanroom facility: 10,000+ m²
• R&D team: 300+ engineers
• Fully proprietary intellectual property